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C. P. WongRegents' Professor Office: Phone: 404-894-8391 Fax: 404-894-9140 |
B.S., Purdue University; Ph.D., Pennsylvania State University
Best Paper Award, 1981, International Society for Hybrids and Microelectronics Annual Meeting; AT&T Engineering Research Center Technical Achievement Award, 1983; AT&T Bell Laboratories Distinguished Technical Staff Award, 1987; AT&T Bell Laboratories Fellow Award, 1992; IEEE Components, Packaging and Manufacturing Technology (CPMT) Society's Outstanding and Best Paper Awards in 1990, 1991, 1994, 1996 and 1998; IEEE-CPMT Society Board of Governors Distinguished Contributions Award, 1991; IEEE Technical Activities Board(TAB) Distinguished Service Award, 1994; IEEE CPMT Society's Outstanding Sustained Technical Contributions Award(the Highest Society Honor), 1995; Outstanding Faculty Research Program Development Award, 1999; NSF-ERC Packaging Research Center Faculty of the Year Award from Georgia Tech, 1999; IEEE Millenium Medal, 2000; University Press (London) Award of Excellence, 2000; Georgia Tech Sigma Xi Faculty Paper, 2000; Elected a member of the National Academy of Engineering, 2000; IEEE EAB Meritorious Achievement Award in Continuation Education Award for Exemplary and Sustained Contributions to Continuing Education in Polymer Materials for Electronic Packaging and Interconnection Worldwide Continue Education Contributions, 2001; IEEE CPMT Society Exceptional Technical Achievement Award, 2002.
Research Interests
Polymer Bonding Materials for Low-cost Chip Packaging. Novel, reworkable, fast-curing, high performance, wafer-level underfill materials are being developed to significantly reduce processing time and cut material costs. This should make flip-chip packages even better solutions for wireless, global positioning and system on-chip PCs and information appliances. Current epoxy-based underfill materials, applied at the individual package level, take so long to process that they become the bottle neck for high volume production. The new materials to be developed are novel polymers that do not exhibit the draw backs of conventional materials, such as high viscosity, long cure time, short shelf-life and susceptiblity to moisture. The new encapsulant materials are expected to provide better bonds for flip-chip packages to a substrate on a printed circuit board. In addition, the research will create ways to deposit that material across the whole wafer in one pass before individual chips are separated from the wafer. This batch processing will make the process much more cost effective.
Selected Recent Publications
C. P. Wong, "Polymers for Encapsulation: Materials Processes and Reliability," Chip Scale Review, 1998, 2(1), 30.
C. P. Wong, S. Shi, G. Jefferson, "High Performance No Flow Underfills for Low-cost Flip-chip Application: Part I - Materials Characterization," IEEE Trans of CPMT, Part A, 1998, 21(3), 450-458.
C. P. Wong, M. Vincent, S. Shi, "Fast Flow Underfill: Flow Rate and Co-efficient of Thermal Expansion," IEEE Trans. on CPMT, Part A, 1998, 21(2), 360
C. P. Wong, I. Segelken, K. Tai, C. Wong, "Non-hermetic Packaging of High Voltage GDX Device with Flip-chip IC," IEEE Trans. on CPMT, Part C, 1998, 21(1), 34-42.
C. P. Wong, J. Wu, R. T. Pike, "Novel Reworkable High Temperature (in excess of 350-400¡C) Adhesives for MCM-D Assembly," Electronic Packaging, 1998, 25, 135.
C. P. Wong, M. B. Vincent, S. H. Shi, "Fast-flow Underfill Encapsulant: Flow Rate and Coefficient of Thermal Expansion," IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 1998, 21(2), 360.
C. P. Wong, M. Vincent, S. Shi, "Fast Flow Underfill: Flow Rate and Co-efficient of Thermal Expansion," IEEE Trans. on CPMT, Part A, 1998, 21(2), 360.
J. Wu, R. T. Pike, C. P. Wong, "Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates," IEEE CPMT, Part C, 1998, 21(4), 311.
C. P. Wong, "Polymers for Encapsulation: Materials Processes and Reliability," Chip and Scale Review, 1998, 2(1), 30-37.
S. Shi, C. P. Wong, "Effect of the Complexed Moisture in Metal Acetylacetonate on the Properties of the No Flow Underfills Materials," J. Applied Polymer Science, 1999, 73, 103-111.
C. P. Wong, L. Wang, S. Shi, "Novel High Performance No Flow and Reworkable Underfills for Flip-chip Applications," Materials Research Innovations, 1999, 2(4), 232-247.
C. P. Wong, M. M. Wong, " Recent Advances in Polymeric Packages and Adhesives," IEEE Trans. on Components and Plastic Packaging of Flip-chip and Multichip Modules of Microelectronics 1999, 22(1), 21-25.
P. Palaniappan, D. Baldwin, J. Wu, C. P. Wong, "Correlation of Flip-chip Underfill Process Parameters and Material Properties with In-process Stress Generation," IEEE Trans. on Electronics Packaging Manufacturing 1999, 22(1), 53-62.
R. Bollampally, C.P. Wong, "Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging," IEEE Transactions on Advanced Packaging, 1999, 22(1), 54- 59.
C. P. Wong, D. Lu, Q. Tong, "Fundamental Understudy of Silver Flake Lubricants in Electrical Conductivity," Conductive Adhesives, 1998, 315.
L. Wang, C. P. Wong, "Novel Thermally Reworkable Underfill Encapsulants for Flip-chip Applications," IEEE Transactions on Advanced, Packaging 1999, 22(1), 46-53.
L. Wang, C. P. Wong, "Syntheses and Characterizations of Thermally Reworkable Epoxy Resins, Part I," J. Polymer Science, Polymer Chemistry, 1999, 37, 2991-3001.
L. Wang, S. Shi, C. P. Wong, "Novel High Performance No Flow and Reworkable Underfills for Flip-chip Applications," Materials Research Innovation, 1999, 2(4), 232-247.
D. Lu, C. P. Wong, "Novel Conductive Adhesives for Surface Mount Applications," J. Applied Polymer Science, 1999, 74, 399-406,
D. Lu, Q. K. Tong, C. P. Wong, "Conductivity Mechanisms of Isotropic Conductive Adhesives," IEEE Trans. on CPMT, Part C 1999, 22(3), 223-227.
D. Lu, Q. K. Tong, C. P. Wong, "Conductivity Mechanisms of Isotropic conductive Adhesives (ICS's)," IEEE Trans. on Electronics Packaging Manufacturing, 1999, 22(3), 228-232.
S. H. Shi, C. P. Wong, "The Effects of the Complexed Moisture in Metal Acetylacetonate on the Properties of the No-flow Underfill Materials," J. Applied Polymer Science 1999, 73, 103-111.
L. Wang, C. P. Wong, "Syntheses and Characterizations of Thermally Reworkable Epoxy Resins. Part 1," J. Polymer Science, Part A: Polymer Chemistry, 1999, 2991-3001.
L. Wang, S. Shi, C. P. Wong, "Novel High Performance No Flow and Reworkable Underfills for Flip-chip Applications," Materials Research Innovation, 1999, 2(4), 232-247.
C. P. Wong, R. S. Bollampally, "Thermal Conductivity, Elastic Modulus, and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging," J. Applied Polymer Science, 1999, 74, 3396-3403.
N. Urasaki, C. P. Wong, "Separation of Low Molecular Siloxanes for Electronic Application by Liquid- Liquid Extraction," IEEE Transactions on Electronics Packaging Manufacturing, 1999, 22(4), 295-298.
N. Rounds, C. P. Wong, "Encapsulation Materials and Processes," John Wiley Encyclopedia on Electrical and Electronic Engineering, 1999, 92- 103.
C. P. Wong, J. Wu, R. T. Pike, "Characterization of Reworkable High Temperature Adhesives for MCM-D Application," J. Applied Polymer Science 1999, 290-295.
J. Wu, R. T. Pike, C. P. Wong, "Novel Bi-layer Conformal Coatings for MEMS Encapsulation/Parylene-C Coated Silicone Elastomers," IEEE Trans. on Electronic Packaging, 1999, 22(3), 195-201.
D. Lu, C. P. Wong, "Characterization of Silver Flake Lubricants," J. Thermal Analysis and Calorimetry 2000, 59, 729-740.
S. Luo, C. P. Wong, "Study on Effect of Carbon Black on Behavior of Conductive Polymer Composites with Positive Temerature Coefficient," IEEE Transactions on Components and Packaging Technologies 2000, 22(1), 151-156.
J. Wu, R. Pike, S. K. Sitaraman, C. P. Wong , "New Reworkable Temperature Low Modules (in Excess of 400-500 ¡C) Adhesives for MCM-D Assembly," J. Electronic Packaging, 2000, 122, 55-59.
Y. Rao, S. Shi, C. P. Wong, "An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants," IEEE Transactions on Components and Packaging Technologies, 2000, 23(3), 434-439.
J. Wu, R. T. Pike, C. P. Wong, M. Tanielian, N. Kim, "Evaluation and Characterization of Reliable Non-Hermetic Coformal Coating for Microelectromechanical (MEMS) Device Encapsulation," IEEE Trans. on Advanced Packaging, 2000, 23(4), 375-381.
D. Lu, D. Wong, C. P. Wong, "Properties of Conductive Adhesives Based on Different Curing Agents,Ó Journal of Electronics Manufacturing," 2000, 9(4), 241-248.
D. Lu, C. P. Wong, "Development of Conductive Adhesives for Solder Replacement,Ó IEEE Transactions on Components and Packaging Technologies," 2000, 23(4), 620-626.
D. Lu, C. P. Wong, "A Study of Contact Resistance of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems," IEEE Transactions on Components and Packaging Technologies, 2000, 23(3), 440-446.
C. P. Wong, S. Luo, Z. Zhang, "Flip the Chip," Science 2000, 290, 2269.
C. P. Wong, S. Luo, "Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging," IEEE Trans. on Components and Packaging Technologies, 2001, 24(1), 38-42.
C. P. Wong, S. Luo, "Effect of UV/Ozone Treatment on Surface Tension and Adhesion in Electronic Packaging," IEEE Trans. on Components and Packaging Technologies, 2001, 24(1), 43-49.
C. P. Wong, Z. Q. Zhang, S. H. Shi, "Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications," IEEE Trans. on Components and Packaging Technologies, 2001, 24(1), 59-66.